Method of making a low-profile crystal package with an improved

Details Method of making a low-profile crystal package with an improved Method of making a low-profile crystal package with an improved

1984-02-15

1985-06-25

Hall, Carl E.

Metal working

Piezoelectric device making

29855, 310348, H01L 4122

Patent

active

045244979

ABSTRACT:
A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.

REFERENCES:
patent: 3916490 (1975-11-01), Sheahan et al.
patent: 3988825 (1976-11-01), Fuchs et al.

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