Method of making a high frequency non-reciprocal circuit element

Details Method of making a high frequency non-reciprocal circuit element Method of making a high frequency non-reciprocal circuit element

1994-10-12

1997-09-02

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156145, 156242, 156277, 333 11, 296021, B32B 3126, B32B 3112

Patent

active

056627548

ABSTRACT:
A high-frequency non-reciprocal circuit element comprises a high-frequency-use magnetic layer and a plurality of center electrodes arranged therein to intersect with each other while being electrically insulated from each other. The plurality of center electrodes are advantageously embedded in the high-frequency-use magnetic layer or layers to be integrated with the same.

REFERENCES:
patent: 5384434 (1995-01-01), Mandai et al.
patent: 5419947 (1995-05-01), Dejima et al.
patent: 5515022 (1996-05-01), Tashiro et al.

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