Method of making a high frequency focused transducer

Details Method of making a high frequency focused transducer Method of making a high frequency focused transducer

1993-06-18

1995-05-09

Vo, Peter Dungba

Metal working

Piezoelectric device making

H01L 4122

Patent

active

054128544

ABSTRACT:
A high frequency focused transducer may be formed by fabricating a piezoelectric or ferroelectric wafer of a thickness less than about 100 microns and bonding a malleable sheet to the wafer with a thin layer of adhesive. Thereafter, the composite may be pressed into a spherical mold to form a curved transducer without fracturing the wafer. In another embodiment, a conductive adhesive layer may be applied to the wafer to a thickness sufficient to hold the wafer in a curved state, when set. After the adhesive is set, the composite may be pressed into the mold while the adhesive is held at an elevated temperature whereat it is elastic. Thereafter the composite is cooled so that the adhesive layer is stabilized and the curved transducer is removed from the well.

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