Method of making a hermetically sealed electronic component

Details Method of making a hermetically sealed electronic component Method of making a hermetically sealed electronic component

1988-03-23

1990-03-06

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 156297, 156300, 156311, 65 5921, 65 5922, 65 5923, 26427211, 501 15, 501 17, 501 21, 501 69, C03B 2900

Patent

active

049063111

ABSTRACT:
A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

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