Method of making a hermetic seal in a solid-state device

Details Method of making a hermetic seal in a solid-state device Method of making a hermetic seal in a solid-state device

1989-05-04

1990-01-23

Godici, Nicholas P.

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228227, 22826312, B23K 119, B23K 3526

Patent

active

048952915

ABSTRACT:
A method of making a hermetic seal for a solid-state device is disclosed. The device includes a ceramic housing having a cavity for an element such as an image sensor. A cover formed of a transparent material is sealed to the housing to close the cavity. A metallization support is formed on the cover and on the housing. In order to form a hermetic seal at a relative low temperature, a layer of indium is coated on the metallization support of either the cover or the housing, and a layer of tin is coated on the support of the other of the two parts. The cover is then placed on the housing, and the parts are placed in a furnace where a temperature under the melting temperature of the composite alloy of tin and indium is maintained for a period long enough to diffuse the tin and indium together. The temperature is then raised to a temperature sufficient to melt the alloy, and the device is then slowly cooled to ambient temperature.

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