Method of making a heatsink device

Details Method of making a heatsink device Method of making a heatsink device

2005-06-28

2008-09-30

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000, C361S689000, C419S006000, C438S122000

Reexamination Certificate

active

07428777

ABSTRACT:
A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.

REFERENCES:
patent: 5413751 (1995-05-01), Polese et al.
patent: 5673174 (1997-09-01), Hamirani
patent: 5972737 (1999-10-01), Polese et al.
patent: 6015008 (2000-01-01), Kogure et al.
patent: 6183874 (2001-02-01), Yamagata et al.
patent: 6196298 (2001-03-01), Shaw
patent: 6250127 (2001-06-01), Polese et al.
patent: D450306 (2001-11-01), Lin et al.
patent: 6418020 (2002-07-01), Lin
patent: D464939 (2002-10-01), Chuang et al.
patent: 6462413 (2002-10-01), Polese et al.
patent: 6505680 (2003-01-01), Hegde
patent: 6534190 (2003-03-01), Yamagata et al.
patent: 6569524 (2003-05-01), Kawai et al.
patent: 6671172 (2003-12-01), Carter et al.
patent: 6714415 (2004-03-01), Shah
patent: 7047639 (2006-05-01), Sheen
patent: 2003/0024693 (2003-02-01), Petty et al.
patent: 2004/0264134 (2004-12-01), Cheng et al.
Research Disclosure “Thermal Cap with Direct Heat Sink” (Published Sep. 1986) Research Disclosure Database No. 269021, Research Disclosure Journal No. 26921.

Affiliated with

Also associated with

Rating

Method of making a heatsink device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a heatsink device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a heatsink device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3987124