Metal deforming – By extruding through orifice – With metal-deforming other than by extrusion
Patent
1999-08-23
2000-10-31
Tolan, Ed
Metal deforming
By extruding through orifice
With metal-deforming other than by extrusion
72302, 72377, 2989003, B21C 2300
Patent
active
061384895
ABSTRACT:
A method of producing a heat transfer device comprising a base (1) and a number of flanges (2) projecting from the base (1), the device being formed with the flanges in a first mutual relation in a first operation and the base being subjected to at least partial deformation in a second operation so that the flanges projecting from the deformed portion of the base are brought into a second mutual relation, the flanges being arranged at shorter mutual distances in the second relation than in the first relation.
REFERENCES:
patent: 2716805 (1955-09-01), Reed
patent: 3866286 (1975-02-01), Pasternak
patent: 4187711 (1980-02-01), Lavochkin et al.
patent: 4447842 (1984-05-01), Berg
patent: 4609040 (1986-09-01), Moore
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4794985 (1989-01-01), Paulman et al.
patent: 4821389 (1989-04-01), Nelson
patent: 4967473 (1990-11-01), Wessel
patent: 4970579 (1990-11-01), Arldt et al.
patent: 5085272 (1992-02-01), Venables, IV
patent: 5201866 (1993-04-01), Mok
patent: 5272599 (1993-12-01), Koenen
patent: 5519938 (1996-05-01), Kojima et al.
patent: 5758418 (1998-06-01), Chrysler et al.
patent: 5802719 (1998-09-01), O'Farrell, Jr. et al.
patent: 5848545 (1998-12-01), Michisaka
patent: 5894882 (1999-04-01), Kikuchi et al.
patent: 5901040 (1999-04-01), Cromwell et al.
AB Webra
Tolan Ed
Vigil Thomas R.
LandOfFree
Method of making a heat transfer device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a heat transfer device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a heat transfer device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2039715