Method of making a heat dissipating assembly

Details Method of making a heat dissipating assembly Method of making a heat dissipating assembly

1987-08-24

1988-04-19

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 16HS, 357 81, 361386, H09K 336

Patent

active

047380241

ABSTRACT:
A heat dissipating assembly for solid state component and control circuitry therefor including a first printed circuit board [45] having a printed circuit thereon for making connections with electronic components [47], fixing the components to the first circuit board, bending the conductors [49] attached to the components to receive a second circuit board [52] that includes control circuitry for the components, and assembling the joined boards into a housing [40].

REFERENCES:
patent: 4204248 (1980-05-01), Proffit et al.
patent: 4344106 (1982-08-01), West et al.
patent: 4387413 (1983-06-01), Griffis
patent: 4631819 (1986-12-01), Lasier et al.
patent: 4669028 (1987-05-01), Faa, Jr.

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