Glass manufacturing – Processes – Operating under inert or reducing conditions
Patent
1978-04-18
1979-09-25
Kellogg, Arthur D.
Glass manufacturing
Processes
Operating under inert or reducing conditions
65 36, 65 41, 65 54, 65 59B, C03B 2702
Patent
active
041689607
ABSTRACT:
A glass encapsulated semiconductor diode and a method for glass encapsulation of a fusion to form a semiconductor diode is disclosed. The fusion comprises a body of semiconductor material having a PN junction therein and metal electrodes affixed to opposed major surfaces thereof. The fusion is encircled by a ring-shaped glass member with an inner surface of the ring-shaped glass member fused to an edge surface of the body of semiconductor material to form a protective layer overlying the PN junction. The ring-shaped glass member is formed and fused to the edge of the body of semiconductor material by placing the fushion and a prefabricated glass ring, preferably cut from stress relieved glass tubing, encircling the fusion in a furnace. A weight is applied to the upper surface of the prefabricated glass ring. An atmosphere comprising a predetermined mixture of nitrogen and water vapor is established in the fusion furnace and the temperature of the fusion furnace is increased and decreased in accordance with a predetermined program to cause the prefabricated glass ring to soften and fuse to the edge surface of the body of semiconductor material to form a protective layer, comprising the ring-shaped glass member, overlying the PN junction.
REFERENCES:
patent: 2046545 (1977-09-01), Sanford et al.
patent: 3271124 (1966-09-01), Clark
patent: 3446695 (1969-05-01), Janakirama-Rao
patent: 3475662 (1969-10-01), Zido
patent: 3476987 (1969-11-01), Zido et al.
patent: 3476988 (1969-11-01), Zido
patent: 3486084 (1969-12-01), Zido
Hinson J. B.
Kellogg Arthur D.
Westinghouse Electric Corp.
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