Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1976-08-03
1978-08-01
Kendall, Ralph S.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
106 128, 252514, 252518, 338308, 338309, 427101, 427102, 427103, 427126, 427282, 427287, 427380, H01C 1012
Patent
active
041044215
ABSTRACT:
A cermet resistor employs film terminations of sub-micron thickness. The terminations contain particles of SiO.sub.2 or MnO.sub.2 that may be conveniently made by mixing such particles in a metal resinate paste, screening the paste on a glazed or unglazed substrate and firing. A glass containing resistor paste is screened in overlapping relationship with the fired terminations and is itself fired. The particle additives ameliorate cracking of the terminations at resistor firing and enhance the termination to substrate bond.
REFERENCES:
patent: 3434877 (1969-03-01), Degenkolb et al.
patent: 3479216 (1969-11-01), Counts et al.
patent: 3718488 (1973-02-01), Trofimenko et al.
patent: 3916037 (1975-10-01), Brady et al.
Kuo, "Electrical Applications of Thin-Films Produced by Metallo Organic Deposition", presented Oct. 22, 1973, pp. 4A-7-1 to 4A-7-8.
Shih, "Improved Silver-Palladium Termination Metallization for Thick Film Resistors", presented Oct. 23, 1974, pp. 35-37.
Johnson Theodore W.
Maher John P.
Kendall Ralph S.
Smith John D.
Sprague Electric Company
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