Method of making a gasket for an electronics enclosure to help k

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156245, 174 35R, 174 35GC, 174 35MS, B29C 4132

Patent

active

046629670

ABSTRACT:
A method of making a shielding gasket integral with a surface comprising the steps of (a) preparing a gasket material consisting of a mixture of an elastomer, a conductive filler, a catalyst and a bonding agent; (b) filling a mold with the gasket material; (c) covering the mold with a surface chosen to be bonded to the gasket; and (d) curing the gasket material in contact with the surface to utilize the bonding agent to bond the gasket material to the chosen surface. The article fabricated by this method comprises a gasket (18b), consisting of a mixture of an elastomer (26), a conductive filler (30) and a bonding agent (28), bonded to a surface (38) by the bonding agent during curing and having the particles comprising the conductive filler held in physical contact with the surface and with one another by the elastomer to which the particles are bonded.

REFERENCES:
patent: 3140342 (1964-07-01), Ehrreich et al.
patent: 3347978 (1967-10-01), Simon et al.
patent: 3609104 (1971-09-01), Ehrreich et al.
patent: 4011360 (1977-03-01), Walsh

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