Method of making a frame package array device

Details Method of making a frame package array device Method of making a frame package array device

2008-04-22

2011-10-04

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S827000, C029S830000, C029S831000, C029S832000, C029S852000

Reexamination Certificate

active

08028397

ABSTRACT:
The present invention uses a frame with one or more axial ribs extending from a spine onto which two or more discrete two-terminal electronic components, such as capacitors, resistors, or inductors, can be attached. The function of the frame is to align and space the electronic components in a single device or array that allows the two-terminals of each component to be separately contacted or soldered to a PC board during final assembly into a circuit. The frame may use friction or a bonding agent to hold the components to the frame. Additionally, the base of the frame forms a single surface for the pick and place equipment used in circuit board assembly. The frame and any bonding agent must be capable of sustaining high temperature soldering operations to form electrical contacts in the circuit assembly operation.

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