Method of making a flexible base plate for printed circuit board

Details Method of making a flexible base plate for printed circuit board Method of making a flexible base plate for printed circuit board

1987-10-27

1988-08-23

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562748, 1563073, 156322, 204165, 427 40, B05D 306, B32B 3128

Patent

active

047658606

ABSTRACT:
The invention provides a method for the preparation of a flexible base for printed circuit board of the type formed of lamination of a flexible sheet-like polymeric base and a metal, e.g. copper, foil adhesively bonded to the surface thereof by use of an adhesive, in which the surface of the polymeric base prior to bonding of the metal foil is subjected to exposure to low temperature plasma so that the adhesive bonding strength between the polymeric base and the metal foil can be greatly improved.

REFERENCES:
patent: 3660190 (1972-05-01), Stroszynski
patent: 4087300 (1978-05-01), Adler
patent: 4374694 (1983-02-01), Blenner
Coopes et al., Gas Plasma Treatment of Polymer Surface, 1982, 217-226.

Affiliated with

Also associated with

Rating

Method of making a flexible base plate for printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a flexible base plate for printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a flexible base plate for printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-834349