Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-09-02
1995-08-08
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29593, 22818021, 324754, H01R 4300
Patent
active
054387493
ABSTRACT:
An interconnect device and method is provided for establishing communications between an electronic circuit board and a microprocessor emulator, so as to permit the evaluation or testing of an electronic circuit or system without a microprocessor flip chip or an integrated circuit socket being present on the circuit board. The flexible interconnect device serves to electrically connect the emulator to the individual conductors which compose a microprocessor flip chip conductor pattern formed on the electronic circuit board. The method involves a reflow soldering technique which bonds the flexible interconnect device to the microprocessor flip chip conductor pattern on the electronic circuit board, so as to form a reliable electrical connection between the flexible interconnect device and the circuit board.
REFERENCES:
patent: 4195195 (1980-03-01), de Miranda et al.
patent: 4611746 (1986-09-01), Levine et al.
patent: 4867715 (1989-09-01), Roth et al.
patent: 4939452 (1990-07-01), Reinholz
patent: 4968589 (1990-11-01), Perry
patent: 5288950 (1994-02-01), Ushio et al.
Goodykoontz, J. R., "A Universal Printed Circuit", Tele-Tech & Electronic Industries, Dec. 1954, p. 74.
Delco Electronics Corp.
Echols P. W.
Navarre Mark A.
LandOfFree
Method of making a flex circuit interconnect for a microprocesso does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a flex circuit interconnect for a microprocesso, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a flex circuit interconnect for a microprocesso will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-964276