Method of making a fiberglass reinforced resin plate

Details Method of making a fiberglass reinforced resin plate Method of making a fiberglass reinforced resin plate

1997-05-21

1999-11-30

Dutton, Brian

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

361807, H01L 2144, H01L 2148, H01L 2150, H05K 702

Patent

active

059941677

ABSTRACT:
The subject invention relates to a method of production of fiberglass reinforced resin plate type semi-conductor diodes, by which the lead wiring of semi-conductor diode is directly included in the production of fiberglass reinforced resin (FRP) foundation plate, to supersede conventional lead frame, to enable the designing of any styles to suit actual needs, and with the design of connecting holes, several layers of different circuits can be connected to comprise 3-dimensional multi-layer circuits.

REFERENCES:
patent: 3827048 (1974-07-01), Usui
patent: 4021839 (1977-05-01), Denlinger
patent: 4079268 (1978-03-01), Fletcher et al.
patent: 5177330 (1993-01-01), Takashashi et al.
patent: 5491111 (1996-02-01), Tai

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