Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-11-17
2010-11-30
Tarazano, D. Lawrence (Department: 1786)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C428S292100, C428S297100, C428S297400
Reexamination Certificate
active
07843057
ABSTRACT:
A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.
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patent: 2005/0034893 (2005-02-01), McCall
patent: 2006/0076683 (2006-04-01), Nishida
patent: 2006/0120059 (2006-06-01), Farkas
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patent: PCT/US2006/044583 (2006-11-01), None
Gary Brist et al., “Woven Glass Reinforcement Patterns,” Printed Circuit Design and Manufacture, Nov. 2004, pp. 28-33.
Howard Heck et al., “AC Common Mode Conversion in Multi-Gb/s Differential Printed Circuit Boards,” Intel Design and Test Technology Conference, 2004.
Alger William O.
Brist Gary A.
Horine Bryce D.
Long Gary B.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Tarazano D. Lawrence
Thompson Camie S
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