Method of making a extended integration semiconductor structure

Details Method of making a extended integration semiconductor structure Method of making a extended integration semiconductor structure

1991-07-24

1993-03-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437215, 437221, 437205, 437974, H01L 2160

Patent

active

051927160

ABSTRACT:
A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.

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