Method of making a dual-in-line package

Details Method of making a dual-in-line package Method of making a dual-in-line package

1983-10-28

1986-01-14

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

357 70, 148 13, H01R 4300

Patent

active

045638110

ABSTRACT:
A lead frame (10) having external leads (26--26) and internal leads (22--22). The internal leads (22--22) are made of soft metal to provide bondability to ceramic substrates having a semiconductor chip thereon while the external leads (26--26) are hard metal to facilitate insertion thereof into a PWB. The lead frame (10) is fabricated by providing a hard metal strip (50) with a soft metal stripe (52) along the central portion thereof. Lead patterns (17--17) are punched in the strip (50) in such a manner as to punch the internal leads (22--22) from the soft metal while simultaneously punching most of the external leads (26--26) from the hard metal. The stripe (52) may be formed by annealing, inlaying or a separate piece of soft metal bonded to two outer hard metal sections (56--56).

REFERENCES:
patent: 3469953 (1969-09-01), St. Clair et al.
patent: 3684464 (1972-08-01), Happ et al.
patent: 3698074 (1972-10-01), Helda et al.
patent: 3978516 (1976-08-01), Noe
patent: 4141029 (1979-02-01), Dromsky
patent: 4151014 (1979-04-01), Charschan et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4331831 (1982-05-01), Ingram et al.
patent: 4413404 (1983-11-01), Burns

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