Method of making a die-stamped circuit board assembly for photof

Details Method of making a die-stamped circuit board assembly for photof Method of making a die-stamped circuit board assembly for photof

1980-03-19

1982-04-20

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29829, 29831, 29832, 29834, 29835, 29846, 431357, 431359, 431365, B32B 3118, F21K 502, H05K 304

Patent

active

043257712

ABSTRACT:
A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without serving the switch material.

REFERENCES:
patent: 2772501 (1956-12-01), Malcolm
patent: 3427714 (1969-02-01), Lemelson
patent: 3857667 (1974-12-01), Vetere et al.
patent: 3911716 (1975-10-01), Weglin
patent: 3990142 (1976-11-01), Weglin
patent: 4017728 (1977-04-01), Audesse et al.
patent: 4113424 (1978-09-01), Armstrong et al.
patent: 4152751 (1979-05-01), Sindlinger et al.
patent: 4164007 (1979-08-01), Audesse et al.

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