Coating processes – Electrical product produced – Welding electrode
Patent
1989-12-07
1991-02-19
Pianalto, Bernard
Coating processes
Electrical product produced
Welding electrode
427 35, 427 36, 427 431, 427 44, 4272082, 4272086, 4272088, 427261, 4272855, 427286, 4273855, B05D 306
Patent
active
049943006
ABSTRACT:
A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which cover is constituted by a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive along the longitudinal direction of said base tape so that said non-adhesive coat has a width greater than that of the chips and less than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.
REFERENCES:
patent: 2307406 (1943-01-01), Howard
patent: 2565509 (1951-08-01), Marcin
patent: 2829073 (1958-04-01), Williams
patent: 3608711 (1971-09-01), Wiesler et al.
patent: 3780856 (1973-12-01), Braverman
patent: 4211329 (1980-07-01), Braverman
Ebe Kazuyoshi
Itou Kazumi
Minagawa Toshio
Lintec Corporation
Pianalto Bernard
LandOfFree
Method of making a cover tape for sealing chip-holding parts of does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a cover tape for sealing chip-holding parts of , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a cover tape for sealing chip-holding parts of will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1142479