Method of making a compliant multichip package

Details Method of making a compliant multichip package Method of making a compliant multichip package

1997-12-12

2000-04-25

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438106, 438108, H01L 2144, H01L 2148, H01L 2150

Patent

active

06054337&

ABSTRACT:
A method of making a multichip package includes providing a flexible substrate having a plurality of conductive traces and flexible leads connected to outer ends of the conductive traces adjacent the periphery of said flexible substrate. The flexible substrate includes conductive terminals accessible at a surface thereof connected to at least some of the conductive traces. The method includes providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with the flexible substrate; depositing a compliant element over the back surface of the first microelectronic element; providing a second microelectronic element having a front face including contacts and assembling the front face thereof with the compliant element so that the second microelectronic element overlies the first microelectronic element; and electrically interconnecting the first and second microelectronic elements with one another and with the conductive terminals by connecting the flexible leads to the second microelectronic element and connecting at least some of the traces to the first microelectronic element.

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