Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2006-08-08
2006-08-08
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
With measuring or testing
C438S597000, C438S622000
Reexamination Certificate
active
07087441
ABSTRACT:
A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs. In an alternative embodiment, the same solder compositions may be deposited on conductor and PTHs of different metal or metal alloy composition. In each embodiment, a single commoning layer (e.g., copper) is used, being partially removed following the first deposition. The solder is deposited using an electroplating process (electroless or electrolytic) and the commoning bar in both depositing steps. An information handling system utilizing the circuitized substrate formed in accordance with the invention is also described.
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Konrad John J.
Kotylo Joseph A.
Rios Jose A.
Dang Phuc T.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
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