Method of making a circuitized substrate for chip carrier struct

Details Method of making a circuitized substrate for chip carrier struct Method of making a circuitized substrate for chip carrier struct

1997-03-20

1999-09-14

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438119, 438122, 257703, 257706, H01L 2144

Patent

active

059535946

ABSTRACT:
An improved method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed, and at least one added layer of metallization is then applied to assure an entirely conductive opening between the member's opposing surfaces. The temporary support assures effective support for the dry film photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps. As taught herein, the entire sidewall portions defining the opening previously occupied by the temporary support portion are metallized to provide enhanced electrical characteristics for the finished product.

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