Method of making a circuitized substrate assembly with carrier h

Details Method of making a circuitized substrate assembly with carrier h Method of making a circuitized substrate assembly with carrier h

1999-01-25

2000-03-14

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29840, H05K 330

Patent

active

060355255

ABSTRACT:
An assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The assembly is thus adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier. The carrier can be of metal or recyclable plastic material.

REFERENCES:
patent: 4520428 (1985-05-01), Lusk
patent: 5394609 (1995-03-01), Ferguson et al.

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