Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-03-06
2007-03-06
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S829000, C029S837000, C029S846000, C029S852000, C216S013000, C216S048000, C216S065000, C257S623000, C257S773000, C257SE21309
Reexamination Certificate
active
10738705
ABSTRACT:
A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at least one side wall is substantially perpendicular to the substantially planar upper surface of the substrate.
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IBM TDB, vol. 29, No. 9, Feb. 1987, “PC Board Construction Method”.
Egitto Frank D.
Knadle Kevin T.
Seman Andrew M.
International Business Machines - Corporation
Phan Tim
Schmeiser Olsen & Watts
Steinberg William H.
Tugbang A. Dexter
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