Method of making a circuitized substrate

Details Method of making a circuitized substrate Method of making a circuitized substrate

1996-04-26

1998-06-16

Chapman, Mark

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

216105, 438694, 438703, 438754, H01L 2102

Patent

active

057664994

ABSTRACT:
A method of making a circuitized substrate wherein a dielectric layer is provided having a first layer of metallic material thereon. A first metallic member is formed on the dielectric's metallic layer, following which a pair of openings are precisely provided within a second dielectric material located on the dielectric. These openings in turn define a selected area on the first metallic member and, significantly, a precisely oriented pattern of the first metallic layer at a spaced distance from the metallic member. This metallic pattern serves as a mask to permit formation of an opening through the dielectric, which opening in turn may be engaged by tooling or the like such as may be used to position an electronic component, e.g., semiconductor device, on the underlying substrate. The invention thus assures precise orientation and placement of components such as semiconductor devices on highly dense circuit patterns such as those required in the present art in the manufacture of devices such as those of the information handling system (computer) variety.

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