Method of making a circuit edit interconnect structure through t

Details Method of making a circuit edit interconnect structure through t Method of making a circuit edit interconnect structure through t

1998-05-07

2000-12-12

Guay, John

Semiconductor device manufacturing: process

Repair or restoration

438 8, 438 14, 438118, 438690, H01L 2100

Patent

active

061597546

ABSTRACT:
A method of making circuit edit structures through the backside of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the backside. Next, a polyimide layer is vapor deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the polyimide layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited polyimide layer from the backside of the integrated circuit to couple together the circuit edit connection targets. The polyimide layer may act as both an insulation layer and an anti-reflective coating layer.

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