Method of making a circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S825000, C029S846000, C029S847000, C438S110000, C438S111000

Reexamination Certificate

active

11224197

ABSTRACT:
Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

REFERENCES:
patent: 3445806 (1969-05-01), Band
patent: 3451793 (1969-06-01), Matsushita
patent: 3469982 (1969-09-01), Celeste
patent: 3663389 (1972-05-01), Koral et al.
patent: 3738835 (1973-06-01), Bakos
patent: 3749657 (1973-07-01), LeBras et al.
patent: 3793278 (1974-02-01), DeBona
patent: 3833436 (1974-09-01), Hillis et al.
patent: 3928157 (1975-12-01), Suematsu et al.
patent: 3947338 (1976-03-01), Jerabek et al.
patent: 3947339 (1976-03-01), Jerabek et al.
patent: 3962165 (1976-06-01), Bosso et al.
patent: 3975345 (1976-08-01), Fessler
patent: 3984299 (1976-10-01), Jerabek
patent: 4001101 (1977-01-01), Bosso et al.
patent: 4116900 (1978-09-01), Belanger
patent: 4134932 (1979-01-01), Kempter et al.
patent: 4238385 (1980-12-01), Okado et al.
patent: 4238594 (1980-12-01), Pampouchidis
patent: 4321290 (1982-03-01), Thams
patent: 4332711 (1982-06-01), Kooymans et al.
patent: 4343885 (1982-08-01), Reardon, Jr.
patent: 4352842 (1982-10-01), Kooymans et al.
patent: 4378264 (1983-03-01), Pilette et al.
patent: 4397990 (1983-08-01), Kooymans et al.
patent: 4401774 (1983-08-01), Kooymans et al.
patent: 4405763 (1983-09-01), Kooymans et al.
patent: 4419467 (1983-12-01), Wismer et al.
patent: 4435559 (1984-03-01), Valko
patent: 4436583 (1984-03-01), Saili et al.
patent: 4495229 (1985-01-01), Wolf et al.
patent: 4508749 (1985-04-01), Brannon et al.
patent: 4592816 (1986-06-01), Emmons et al.
patent: 4601916 (1986-07-01), Arachtingi
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4788246 (1988-11-01), Tsuchiya et al.
patent: 5096556 (1992-03-01), Corrigan et al.
patent: 5134056 (1992-07-01), Schmidt et al.
patent: 5153986 (1992-10-01), Brauer et al.
patent: 5188716 (1993-02-01), Schwerzel et al.
patent: 5200461 (1993-04-01), Tsuchiya et al.
patent: 5224265 (1993-07-01), Dux et al.
patent: 5227008 (1993-07-01), Klun et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5232548 (1993-08-01), Ehrenberg et al.
patent: 5242713 (1993-09-01), Viehbeck et al.
patent: 5242780 (1993-09-01), Lin et al.
patent: 5250164 (1993-10-01), Valko
patent: 5291066 (1994-03-01), Neugebauer et al.
patent: 5298685 (1994-03-01), Bindra et al.
patent: 5316787 (1994-05-01), Frankeny et al.
patent: 5319158 (1994-06-01), Lee et al.
patent: 5362359 (1994-11-01), Horikoshi et al.
patent: 5590460 (1997-01-01), DiStefano et al.
patent: 5600035 (1997-02-01), Kahle, II et al.
patent: 5601905 (1997-02-01), Watanabe et al.
patent: 5847327 (1998-12-01), Fischer et al.
patent: 5879808 (1999-03-01), Wary et al.
patent: 6066512 (2000-05-01), Hashimoto
patent: 6080526 (2000-06-01), Yang et al.
patent: 6107003 (2000-08-01), Kuwako
patent: 6130148 (2000-10-01), Farnworth et al.
patent: 6130149 (2000-10-01), Chien et al.
patent: 6150284 (2000-11-01), Kawahara
patent: 6165338 (2000-12-01), December et al.
patent: 6177357 (2001-01-01), Lu
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6303230 (2001-10-01), Watanabe et al.
patent: 6314639 (2001-11-01), Corisis
patent: 6333555 (2001-12-01), Farnworth et al.
patent: 6344371 (2002-02-01), Fischer et al.
patent: 6379865 (2002-04-01), Mao et al.
patent: 6472726 (2002-10-01), Hashimoto
patent: 6555200 (2003-04-01), Hashimoto
patent: 6559245 (2003-05-01), Mao et al.
patent: 2001/0029065 (2001-10-01), Fischer et al.
patent: 2002/0004982 (2002-01-01), Haze et al.
patent: 2002/0086236 (2002-07-01), Eitouni et al.
patent: 2003/0180664 (2003-09-01), Mao et al.
patent: 2003/0211425 (2003-11-01), Mao et al.
patent: 573053 (1995-10-01), None
patent: 2041471 (1971-01-01), None
patent: 59133232 (1984-07-01), None
patent: 2087590 (1990-03-01), None
patent: 5320313 (1993-12-01), None
patent: 6268378 (1994-09-01), None
patent: 11021359 (1999-01-01), None
patent: 11071501 (1999-03-01), None
patent: 11145205 (1999-05-01), None
patent: 2001305750 (2001-11-01), None
“Printed wiring boards incorporating Cu-invar-Cu layers”, Alfred Goberecht, Electronic Components and Applications, vol. 10, No. 1, pp. 12-16.
Polymers for Microelectronics, Presented at the 203rdNational Meeting of American Chemical Society, Apr. 1992, Chapter 35, pp. 507-508, Larry F. Thompson et al.
Handbook of Flexible Circuits, p. 242, 1991, Ken Gilleo.
Handbook of Polymer Coatings for Electronics, pp. 114-118, 2ndEd., James J. Licari et al.
PARYLENE: A Protective Conformal Coating for Hybrid Circuits, Speedline Technologies (2000).
SCS Parylene Specifications and Properties product literature, Speedline Technologies (2000).
Encyclopedia of Chemical Technology, Fourth Ed., Supplement Volume, pp. 863-901 (1998).
IPC-TM-650 Test Methods Manual, No. 2.3.10, Flammability of Laminates Dec. 1994, pp. 1-3.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3727852

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.