Method of making a circuit assembly

Details Method of making a circuit assembly Method of making a circuit assembly

1990-02-16

1991-12-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29413, 295921, 357 74, H01R 4300

Patent

active

050706020

ABSTRACT:
An electric circuit assembly and method provides direct bonding of a copper lead frame pattern (430) on a ceramic substrate (402), including the provision of numerous isolated lead frame segments of small size, without requiring individual oxidation nor placement of same on the substrate, and eliminating loss of alignment during fusing during direct bonding. The lead frame pattern (430) includes a plurality of lead frames (432) interconnected and held together by support bridges (434) therebetween. The support bridges (434) are designed to vaporize, open, retract and disappear during the direct bonding operation, resulting in direct bonded fusion of the copper lead frames (432) to the ceramic substrate (402), and eliminating any remnant of the support bridges (434).

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"Over 50 years of experience with the Direct Bond Copper process", Tegmen Corp., 1201 East Fayette Street, Syracuse, New York 13210.

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