Method of making a circuit assembly

Details Method of making a circuit assembly Method of making a circuit assembly

1983-08-26

1985-03-12

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

339 17F, H01R 400

Patent

active

045036110

ABSTRACT:
A circuit assembly and method of making the same involves locating a flat flexible circuit member with an electrically conducting region defined thereon between a pair of opposed, relatively rigid wafers with a pin conductor inserted through the member and the wafers. Each wafer includes an aperture extending through the wafer, the aperture of one wafer aligned with the aperture of the other wafer and arranged to abut with the conducting region at the point of desired termination. The pin conductor is forced into and is retained within each aperture in each wafer, piercing the conducting region on the flat flexible circuit member in the process and making electrical contact with the conducting region. A portion of the pin conductor extends outwardly of one of the wafers for electrical connection to a female connector.

REFERENCES:
patent: 3444506 (1969-05-01), Wedekind
patent: 3562798 (1971-02-01), Bragg, Jr.
patent: 3858159 (1974-12-01), Worth
patent: 3924325 (1975-12-01), Kufner
patent: 3938245 (1976-02-01), Lovendusky et al.
patent: 4012093 (1977-03-01), Crane
patent: 4125310 (1978-11-01), Reardon
IBM Tech Disclosure Bulletin vol. 9, No. 10, Mar. 1967, p. 1283, by D. O. Johnson, Jr.

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