Method of making a chemically bonded coating on a fibrous or fil

Details Method of making a chemically bonded coating on a fibrous or fil Method of making a chemically bonded coating on a fibrous or fil

1985-02-13

1987-08-18

Page, Thurman K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 38, 427 41, 427 96, 427 99, 428260, B05D 306

Patent

active

046876812

ABSTRACT:
Disclosed is a method of coating a fibrous or filamentous organic polymeric substrate by forming a liquid which comprises an organic compound having a vapor pressure of less than about 400 mm at room temperature, applying the liquid to the substrate, evaporating any solvent which is present, and exposing the liquid to an ionized non-polymerizing inorganic gas. Also disclosed is a coated substrate comprising a fibrous or filamentous substrate made of an organic polymeric material and a saturated aliphatic hydrocarbon coating on the substrate polymerized and chemically bonded to the polymeric material. A laminate is made by impregnating the treated substrate with an organic impregnating resin, heating the impregnated treated substrate to evaporate any solvent and to partially cure the organic impregnating resin, forming a prepreg, forming a stack of a plurality of prepregs, and heating the stack under pressure to fully cure the impregnating resin. Copper can be placed at one or both ends of the stack prior to fully curing the impregnating resin in order to form a circuit board.

REFERENCES:
patent: 3817771 (1974-06-01), Nakayama et al.
patent: 4123308 (1978-10-01), Nowlin et al.
patent: 4131691 (1978-12-01), Morley et al.
patent: 4188426 (1980-02-01), Averbach
patent: 4524089 (1985-06-01), Haque et al.
patent: 4526806 (1985-07-01), Haque et al.
patent: 4533369 (1985-08-01), Okita

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