Method of making a ceramic semiconductor package having crack ar

Details Method of making a ceramic semiconductor package having crack ar Method of making a ceramic semiconductor package having crack ar

1989-12-18

1990-12-11

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29846, 427 96, 427284, H01L 2314

Patent

active

049768140

ABSTRACT:
A ceramic semiconductor package wherein metal crack arrestor patterns are formed in the corners of the package thereby increasing the strength of the package and acting as a barrier to microcracks. The metal crack arrestor patterns may be electrically and physically isolated from metal interconnect lines in the package and also may be formed using the same processing steps that are used to form the metal interconnect lines.

REFERENCES:
patent: 3628983 (1971-12-01), Leger et al.
patent: 4278707 (1981-07-01), Biran
"IBM Technical Disclosure Bulletin", vol. 21, No. 5, Oct. 1978; Stand-Offs for Double-Sided Screening of Ceramic Green Sheets, Hetherington, et al.

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