Method of making a center bond flip chip semiconductor carrier

Details Method of making a center bond flip chip semiconductor carrier Method of making a center bond flip chip semiconductor carrier

2006-08-15

2006-08-15

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

Reexamination Certificate

active

07091065

ABSTRACT:
A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.

REFERENCES:
patent: 5400220 (1995-03-01), Swamy
patent: 5818697 (1998-10-01), Armezzani et al.
patent: 6056557 (2000-05-01), Crotzer et al.
patent: 6140707 (2000-10-01), Plepys et al.

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