Method of making a casing for receiving electronic components or

Metal founding – Process – Shaping liquid metal against a forming surface

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

164113, 164 97, B22D 1900, B22D 1700

Patent

active

058734023

ABSTRACT:
A process of making a casing having at least one open end and formed with electric conducting passages and connections for electronic components or switching circuits, includes the following steps: preparing a formed body, made of ceramics, glass, glass-ceramics, metal or silicon carbide, with passageways in form of bores and/or indentations, placing the formed body in a mold and pouring liquid metal in the mold to surround the formed body, thereby filling the first passageways, and removing metal from the formed body to leave metal only in the first passageways.

REFERENCES:
patent: 5198885 (1993-03-01), Shawki
patent: 5371043 (1994-12-01), Anderson et al.
patent: 5480727 (1996-01-01), Romero et al.
patent: 5526867 (1996-06-01), Keck et al.
patent: 5657811 (1997-08-01), Cook
patent: 5662157 (1997-09-01), Cook
Patent Abstracts of Japan vol. 012, No. 077 (E-589), Mar. 10, 1988 & JP 62 217641 A (Kyocera Corp), Sep. 25, 1987, *abstract*.
Patent Abstracts of Japan vol. 010, No. 332 (E-453), Nov. 12, 1986 & JP 61 137350 A (Nec Corp), Jun. 25, 1986, *abstract*.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a casing for receiving electronic components or does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a casing for receiving electronic components or, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a casing for receiving electronic components or will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-299157

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.