Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Patent
1997-05-22
1998-10-13
Bowers, Jr., Charles L.
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
438253, 438947, 438964, H01L 2120, H01L 218242
Patent
active
058211519
ABSTRACT:
A method of manufacturing a capacitor for use in semiconductor memories includes forming an undoped dot silicon layer on a doped polysilicon layer. Thermal oxidation is used to convert the dot silicon layer and portions of the doped polysilicon layer into silicon oxide. Then a CMP process is used to remove the oxidized dot silicon layer to create a silicon oxide etching mask. Next, an etching process is performed to form a large number of cavities in the doped polysilicon layer. The silicon oxide layer is then removed and the doped polysilicon layer is patterned and etched to form a bottom storage node of the capacitor.
REFERENCES:
patent: 5670406 (1997-09-01), Tseng
patent: 5670407 (1997-09-01), Tseng
patent: 5681774 (1997-10-01), Tseng
Bowers Jr. Charles L.
Thomas Toniae M.
Vanguard International Semiconductor Corporation
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