Method of making a bipolar semiconductor device

Fishing – trapping – and vermin destroying

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357 34, 437193, 437 31, 437247, H01L 2136, H01L 2138, H01L 2142, H01L 2100

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047102411

ABSTRACT:
An n-type buried layer is selectively formed in a surface region of a p-type semiconductor substrate. At least one insulating film is formed on the semiconductor substrate. A first opening is formed on the buried layer in the insulating film. An n-type polycrystalline silicon layer is formed in the first opening connected to the buried layer. A second opening is formed on the buried layer of the insulating film. An n-type monocrystalline silicon layer is formed in the second opening connected to the buried layer. A p-type base region is formed in the monocrystalline silicon layer and a collector region is formed in the remaining portion of the monocrystalline silicon layer. An emitter region is selectively formed in the base region.

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Jap. J. of Applied Physics, vol. 21, No. 9, Sep. 1982, pp. 564-566, by Kohetsu Tanno et al., "Selective Silicon Epitaxy Using Reduced Pressure Technique".
J. Electrochem. Soc. Solid State Science and Technology, vol. 120, No. 5, pp. 664-668, by P. Rai-Choudhury et al., "Selective Silicon Epitaxy and Orientation Dependence of Growth".

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