Method of magnetic field assisted self-assembly

Details Method of magnetic field assisted self-assembly Method of magnetic field assisted self-assembly

2007-05-15

2007-05-15

Tsai, H. Jey (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C438S120000

Reexamination Certificate

active

11077961

ABSTRACT:
A method for assembling and integrating microstructures (pills) onto a substrate. A plurality of patterned recesses are formed on the substrates, the recesses having transverse cross-sections and openings of specific shapes. A hard magnetic layer is deposited at the bottom of each said recess. A guide is positioned over the substrate, the guide having patterned hole shapes matching the shapes of the openings to the patterned recesses with which the holes mate. A collection of the pills is placed atop the guide. The said collection includes members with cross-sections matching the shapes of the openings to the recesses, and each pill is coated at one end with a soft magnetic layer. A moving magnetic field is applied to the collection of pills to agitate the pills, and effect a magnetic attraction between the layers at the ends of the pills and the soft magnetic layer at the bottom of the recesses. The pills fall through the similarly shaped guide holes and into the recesses and are firmly attracted to the bottoms of the recesses by the magnetic attractive forces.

REFERENCES:
patent: 5962975 (1999-10-01), Lepselter
patent: 6888178 (2005-05-01), Fonstad et al.
patent: 2003/0182794 (2003-10-01), Fonstad, Jr. et al.
patent: 2005/0009303 (2005-01-01), Schatz
Sudhakar Shet et al., The Magnetic Field-Assisted Assembly of Nanoscale Semiconcudtor Devices: A New Technique, JOM, Oct. 2004, 32-34.

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