Method of machining wafer

Details Method of machining wafer Method of machining wafer

2008-05-23

2009-10-27

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S459000

Reexamination Certificate

active

07608483

ABSTRACT:
A method of machining a wafer, wherein a wafer provided with devices each having a low dielectric constant insulating film (low-k film) stacked on the face side thereof is divided into the individual devices, the devices thus divided are mounted on a wiring board, and then a grindstone is brought into contact with each of the mounted devices from the side of a side surface of the devices, to grind the back side of the device by a desired amount. Since no vertical load is exerted on the low-k film, the low-k film can be prevented from being broken, and device quality is not lowered.

REFERENCES:
patent: 6936499 (2005-08-01), Shibata et al.
patent: 7278903 (2007-10-01), Masuda
patent: 7384812 (2008-06-01), Misawa
patent: 7462094 (2008-12-01), Yoshida et al.
patent: 7527547 (2009-05-01), Kajiyama et al.
patent: 2007/0093040 (2007-04-01), Sekiya
patent: 2008/0318362 (2008-12-01), Miyazaki et al.
patent: A 2006-303051 (2006-11-01), None

Affiliated with

Also associated with

Rating

Method of machining wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of machining wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of machining wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4131945