Method of locating failure site on semiconductor device...

Details Method of locating failure site on semiconductor device... Method of locating failure site on semiconductor device...

2011-04-19

2011-04-19

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S750010

Reexamination Certificate

active

07928748

ABSTRACT:
In an analysis of a semiconductor device under test (DUT) using a Thermal Induced Voltage Alteration (TIVA) tool, the TIVA is connected to an output of the DUT and the DC component on the output is decoupled from the TIVA. The remaining AC component from the output is analyzed by the TIVA while scanning the DUT with a scanning laser to identify locations on the DUT that produce signal anomalies at the DUT output.

REFERENCES:
patent: 6952106 (2005-10-01), Ng et al.
patent: 6967491 (2005-11-01), Perdu et al.
patent: 7511510 (2009-03-01), Kaszuba et al.

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