Method of localized treatment on a projection, in particular for

Fishing – trapping – and vermin destroying

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437229, H01L 21302

Patent

active

052832090

ABSTRACT:
In the method, a protective resist (108) used for lithographic etching is caused to flow plastically under the constraint of its surface tension, thereby increasing its thickness around a projection (106) on which a window (104) is to be formed. The invention is particularly applicable to manufacturing semiconductor lasers.

REFERENCES:
patent: 4722910 (1988-02-01), Yasaitis
patent: 4789646 (1988-12-01), Davis
patent: 4978419 (1990-12-01), Nanda et al.
patent: 5093225 (1992-03-01), Holmstrom et al.
patent: 5155060 (1992-10-01), Ikeno et al.
Ralph Williams, Modern GaAs processing Methods, Artech House, Boston & London, pp. 115-133 (date unknown).
"Postloped vias", IBM Technical Disclosure Bulletin, vol. 32, No. 8B, Jan. 1990, pp. 443-445, New York.

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