Metal fusion bonding – Process – Plural diverse bonding
Patent
1989-09-05
1991-01-29
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural diverse bonding
228190, 228194, B23K 2002
Patent
active
049880357
ABSTRACT:
Insert 1 comprises thin substrate made by cold-rolling, and two bonding alloy layers formed by plating on the upper and lower surfaces of substrate, respectively. Both layers is extremely thin, and is made of an alloy having a melting point lower than that of substrate. Insert 1 is used to achieve liquid phase diffusion bonding of first and second base metals. Insert 1 is interposed between first base metal and second base metal. Then, insert 1 and base metals are clamped together with a pressure of, for example, 0.5 kgf/mm.sup.2, and are placed in a atmosphere of a low pressure of about 10.sup.-4 Torr and heated to the melting point of alloy layers or to a temperature above this melting point but below the melting points of substrate and plates.
REFERENCES:
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3859144 (1975-01-01), Basche et al.
patent: 3981429 (1976-09-01), Parker
patent: 4029479 (1977-06-01), Parker
patent: 4034906 (1977-07-01), Carlson et al.
patent: 4059217 (1977-11-01), Woodward
patent: 4122992 (1978-10-01), Duvall et al.
patent: 4336292 (1982-06-01), Blair
patent: 4340650 (1982-07-01), Pattanaik et al.
patent: 4562121 (1985-12-01), Thiemann et al.
patent: 4674675 (1987-06-01), Mietrach
patent: 4691856 (1987-09-01), Haramaki et al.
patent: 4705207 (1987-11-01), Norris
patent: 4715525 (1987-12-01), Norris
Kagechika Hiroshi
Kojima Toshifumi
Kosuge Shigeyoshi
Ueno Yasuhiro
Watanabe Itaru
Nippon Kokan Kabushiki Kaisha
Ramsey Kenneth J.
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