Method of lifting off and fabricating array substrate for...

Details Method of lifting off and fabricating array substrate for... Method of lifting off and fabricating array substrate for...

2011-08-02

2011-08-02

Tran, Binh X (Department: 1713)

Etching a substrate: processes

Forming groove or hole in a substrate which is subsequently...

C216S040000, C216S041000, C216S043000

Reexamination Certificate

active

07988871

ABSTRACT:
A method of lifting off includes forming a first material layer on a substrate; forming a photoresist pattern including first and second holes and on the first material layer; patterning the first material layer using the photoresist pattern as a patterning mask to form a material pattern having first and second grooves within the material pattern, the first and second grooves corresponding to the first and second holes, respectively; forming a second material layer on an entire surface of the substrate including the photoresist pattern and the first and second grooves; and removing the photoresist pattern and the second material layer on the photoresist pattern at the same time, wherein a portion of the material pattern between the first and second grooves and portions of the material pattern at sides of the first and second grooves constitute a line as a whole.

REFERENCES:
patent: 2006/0113539 (2006-06-01), Sano et al.
patent: 2006/0160340 (2006-07-01), Takei et al.

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