Method of laying tile-like flooring members on a floor

Static structures (e.g. – buildings) – Processes – Assembling exposed modules

Patent

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Details

521266, 52778, 52488, E04B 100

Patent

active

047441941

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

This invention relates to a method of laying tile-like flooring members, such as pieces of carpets, flooring boards, etc., on the surface of a floor.


BACKGROUND ART

In laying such tile-like members on a floor, each piece must be laid one by one. In this process, however, the members are apt to slide, or to expand or contract according to changes in the temperature. As a result there is a tendency to develop gaps between neighbouring pieces, or wrinkle in the pieces, with consequential deterioration of the appearance of the finished floor.
It is known to apply an adhesive agent or double coated adhesive tape to edge portions of the pieces being laid, to establish their positions firmly and avoid irregularities. However, this practice is very time consuming, and moreover, it is difficult to lay down a large number of tile-like flooring pieces precisely in this way, because there is a dimensional tolerance in the manufacturing of the tile-like pieces themselves.
Further, it is difficult to remove or rearrange the pieces. They cannot be conveniently removed, since the adhesive agent remains on the surface of the floor, even if the tile-like pieces have been peeled away. Moreover, in an office there will often be electric power and telephone cables as well as cables connecting office appliances to be arranged to extend across the floor.
The principal object of the present invention is to provide a method of laying tile-like flooring members in a manner that enables a large number of such members to be laid easily and precisely.
A second object of the invention is to provide a method that facilitates removal or rearrangement of the members.
A third object of the invention is to provide a method of laying tile-like flooring members in a manner that enables such members to be laid without irregularities caused on the surface of the members even being applied on such a floor where electric and telephone wires and cables are arranged across and rearrangement of them are often required afterwards.


DISCLOSURE OF INVENTION

To the above mentioned ends, the invention consists of a method of laying tile-like flooring members on a surface comprising forming on said surface an interconnected framework of a plurality of frame members having the same thickness as each other to provide an array of recesses, and laying in each said recess a tile-like flooring member having on its undersurface a projection for snugly engaging each said recess, projecting edges of said flooring members extending over the frame members to engage each other and together form a continuous floor covering.
Further, according to afore said method of laying tile-like flooring materials of the invention, a space is formed on the lower portion of the projection of at least one tile-like flooring material, a communicating portion is formed on the lower surface of at least one plate like frame member, and a cable is inserted through the space and the communicating portion. Whereby, it is possible to prevent irregularities on tile-like flooring materials and to rearrange easily the cables underneath the flooring materials.


BRIEF EXPLANATION OF DRAWINGS

Now, description will be made with reference to attached drawings to explain the invention further in detail.
In the drawings:
FIG. 1 is a schematic, perspective view showing a method of laying tile-like flooring members according to a first embodiment of the invention;
FIGS. 2-6(a) are perspective views of respective frame members;
FIG. 6(b) is a perspective view of the frame member shown in FIG. 6(a), as viewed from underneath;
FIG. 6(c) is a perspective view of a support for use with the frame member;
FIGS. 7-9 are perspective views of respective frame members to be employed at edge portions;
FIG. 10 is a perspective view of a tile-like flooring member, as viewed from underneath;
FIGS. 11-13 are explanatory views, showing a procedure according to the invention;
FIG. 14 is an enlarged sectional view taken along the line XIV--XIV in FIG. 12;
FIG. 15 is an enlarged sectional view, tak

REFERENCES:
patent: 350101 (1886-10-01), Bates
patent: 2049427 (1936-08-01), Denk
patent: 2293431 (1942-08-01), Frease
patent: 3153304 (1964-10-01), Evangelista
patent: 3157254 (1964-11-01), Spiselman et al.
patent: 3685235 (1972-08-01), Lang
patent: 4561232 (1985-12-01), Gladden, Jr. et al.

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