Method of laying out bond pads on a semiconductor die

Details Method of laying out bond pads on a semiconductor die Method of laying out bond pads on a semiconductor die

1994-05-31

1995-08-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 437206, 437217, 437220, H01L 2144

Patent

active

054419174

ABSTRACT:
Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith by a bond wire or lead frame lead and aligns to the approach angle of the conductive line to which it is connected. Alternating, interleaved, complementary wedge-shaped bond pads are discussed. Bond pad liftoff is reduced by providing an upper bond pad, a lower bond pad and an insulating component between the upper and lower bond pads. At least one opening is provided through the insulating component, extending from the bottom bond pad to the upper bond pad. The at least one opening is aligned with a peripheral region of the bottom bond pad and is filled with conductive material.

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