Method of laying a floor

Static structures (e.g. – buildings) – Processes – Assembling exposed modules

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Details

527461, 5274521, 52390, 52177, E04B 110

Patent

active

055642519

ABSTRACT:
A method of laying a floor wherein the floor is built up of parts butting together at edge portions thereof and, which are laid on a subfloor. A layer formed of one of an elastic and/or resilient material is provided on at least part of a subfloor in a taut condition. Parts butting against each other are successively glued onto the layer of a resilient material. The layer of one of an elastic and resilient material may at an upper side thereof be provided with an adhesive layer covered by paper or a paper like material.

REFERENCES:
patent: 4557475 (1985-12-01), Donovan
patent: 4674245 (1987-06-01), Turner
patent: 5067298 (1991-11-01), Petersen
patent: 5331787 (1994-07-01), Paulitschke et al.
patent: 5357724 (1994-10-01), Sonoda

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