Method of laser trimming

Details Method of laser trimming Method of laser trimming

1991-04-23

1992-03-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

148DIG93, H01L 21268

Patent

active

050968505

ABSTRACT:
A method including covering the area to be laser trimmed with a first insulative layer having a thickness sufficiently thin that a layer can trim the area through the first insulative layer. An etch stop is formed on the first insulative layer over the area to be trimmed and covered with a second insulative layer. A portion of the second insulative layer is etched to expose the etch stop and a portion of the etch stop is then removed to expose a portion of the first insulative layer and laser trimming is conducted through the exposed first insulative layer. The etch stop is part of a first level of interconnects made of the same material and simultaneously with the etch stop. The area to be trimmed is part of a second level of contacts that interconnect another second material.

REFERENCES:
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4960729 (1990-10-01), Orbach
M. J. Rand, "Reliability of LSI Memory Circuits Exposed to Laser Cutting", 17th Annual Proceedings Reliability Physics, San Francisco, Calif. (24-26 Apr. 1979), pp. 220-225.
J. B. Gullette & D. M. Green, "Laser Personalization of NMOS Digital Topologies", 1983, IEEE International Symposium on Circuits and Systems, Newport Beach, Calif. 2-4 May 1983, vol. 3, pp. 1249-1252.

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