Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...
Patent
1992-06-23
1994-04-26
Kight, III, John
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Compositions to be polymerized by wave energy wherein said...
528 26, 528125, 528128, 528170, 528172, 528173, 528176, 528185, 528188, 528220, 528229, 528351, 528352, 528353, 427 96, 427306, 427307, 427322, 427437, 427595, 4284735, C08J 328, C08C 7310
Patent
active
053067410
ABSTRACT:
An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. Thereafter, a solution of a precursor of a thermoplastic polyimide is applied onto the first film of polyimide and the solvent is removed to form a dry tack-free second film. Both films are then cured concomitantly at a sufficiently rapid rate and low temperature to effect substantial imidization of the polyimide precursors of both films without substantial crosslinking or densification of the polyimides in either of the films. Thereafter, a metal sheet or foil is laminated onto the thermoplastic polyimide film according to the following process. The thermoplastic film is contacted with the sheet or foil of metal to be laminated thereto. A first pressure is applied to the metal sheet and the polyimide substrate composite, which pressure is sufficiently low to permit outgassing of any gases trapped or generated within the polyimides and the temperature is increased. The temperature is raised to a level to essentially complete imidization of the polyimides and also to expel any gases contained or generated by said polyimide films. Thereafter, the pressure is increased to a second level or value and the temperature is controlled to a value which temperature is above the T.sub.g of the thermal plastic film. This second pressure is sufficiently high to complete the lamination of the metal sheet or foil to the thermoplastic polyimide.
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IBM Technical Disclosure Bulletin, vol. 31, No. 11, Apr. 1989, pp. 32-33.
Chen Pei C.
Kindl Thomas E.
Rickerl Paul G.
Schadt Mark J.
Stephanie John G.
Hampton-Hightower P.
International Business Machines - Corporation
Kight III John
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