Method of laminating a cover layer for flexible circuits

Details Method of laminating a cover layer for flexible circuits Method of laminating a cover layer for flexible circuits

1976-09-27

1978-07-04

Kendall, Ralph S.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Making electrical conductors of indefinite length

156 55, 156335, 174117F, 174110N, 174117FF, 427118, 427120, 428480, 428414, 428460, 428524, H01B 1306

Patent

active

040986284

ABSTRACT:
A method of laminating a cover layer for flexible circuits which provides increased flexibility. The cover layer encapsulates a flexible circuit having a plurality of spaced conductors on a flexible insulating substrate. The cover layer is a tri-layered laminate having a first layer of insulating film, a second intermediate layer of a thermosetting adhesive, and a third layer of a phenolic resin adhesive. The cover layer is bonded to the flexible circuit with the third layer of phenolic resin adhesive being contiguous the conductors.

REFERENCES:
patent: 3097036 (1963-07-01), Cornell
patent: 3391246 (1968-07-01), Freeman et al.
patent: 3547718 (1970-12-01), Gordon
patent: 3932689 (1976-01-01), Watanabe et al.

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