Superconductor technology: apparatus – material – process – Processes of producing or treating high temperature... – With melting
Patent
1994-09-15
1996-05-28
Heinrich, Samuel M.
Superconductor technology: apparatus, material, process
Processes of producing or treating high temperature...
With melting
228198, 505927, H01L 3900
Patent
active
055211500
ABSTRACT:
Disclosed is a method of joining Y-based oxide superconductors on joining two or more Y-based oxide superconductors made by melting process under pressure, characterized by incorporating REBa.sub.2 Cu.sub.3 O.sub.7-.delta. (RE=Y, Ho, Er, Tm or Yb), Ag and BaCuO.sub.2 -CuO type composition to the joining interface as an adhesive phase for joining. It becomes possible to easily make a joined material that does not deteriorate the superconductive characteristic at joined interface.
REFERENCES:
patent: 3737989 (1973-06-01), Schaetti
patent: 4914081 (1990-04-01), Miller et al.
patent: 5100870 (1992-03-01), Chen et al.
patent: 5134040 (1992-07-01), Benz et al.
patent: 5164361 (1992-11-01), Aprigliano et al.
patent: 5244876 (1993-09-01), Preisler et al.
patent: 5262391 (1993-11-01), Morita et al.
Japanese Journal of Applied Physics, vol. 28, No. 7, Jul. 1989, Masato Murakami, et al., "A New Process with the Promise of High Jc in Oxide Superconductors", pp. 1189-1194.
Appl. Phys. Lett. 60 (7), Feb. 17, 1992, K. Salama, et al., "Joining of High Current Bulk Y--Ba--Cu--O Superconductors", pp. 898-900.
Murakami Masato
Sakai Naomichi
Takaichi Hiroshi
Heinrich Samuel M.
International Superconductivity Technology Center
Shikoku Denryoku Kabushiki Kaisha
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