Method of joining shielding used for minimizing EMI or RFI, and

Details Method of joining shielding used for minimizing EMI or RFI, and Method of joining shielding used for minimizing EMI or RFI, and

1990-06-15

1992-05-26

Picard, Leo P.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 35R, 295921, 228179, H05K 900, H01S 400, B23K 3102

Patent

active

051170655

ABSTRACT:
A method of joining shielding materials used for minimizing passage of electromagnetic and radio frequency energy through the walls of an enclosure, comprising the steps of securing a metallic backing plate to one wall of the enclosure, positioning an end portion of a first sheet of shielding material to the backing plate, then positioning an end portion of second sheet of shielding material atop the end portion of the first sheet of shielding material, and then applying a vibrating tool to the overlapped end portions of the first and second sheets of shielding material to metallurgically bond the facing surfaces of the overlapped shielding materials. A joint structure resulting from practice of the method is also disclosed.

REFERENCES:
patent: 4890083 (1989-12-01), Trenkler et al.
patent: 4893744 (1990-01-01), Takayasu

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